- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
Patent holdings for IPC class H01L 23/522
Total number of patents in this class: 13440
10-year publication summary
|
888
|
1058
|
1337
|
1344
|
1492
|
1699
|
1656
|
1518
|
1498
|
483
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
3128 |
| Samsung Electronics Co., Ltd. | 131630 |
1071 |
| Intel Corporation | 45621 |
726 |
| International Business Machines Corporation | 60644 |
696 |
| Micron Technology, Inc. | 24960 |
381 |
| Qualcomm Incorporated | 76576 |
340 |
| Kioxia Corporation | 9847 |
319 |
| Sandisk Technologies LLC | 5684 |
291 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
277 |
| Sony Semiconductor Solutions Corporation | 8770 |
267 |
| SK Hynix Inc. | 11030 |
266 |
| Renesas Electronics Corporation | 6305 |
252 |
| Texas Instruments Incorporated | 19376 |
194 |
| Nanya Technology Corporation | 2000 |
160 |
| United Microelectronics Corp. | 3921 |
151 |
| Yangtze Memory Technologies Co., Ltd. | 1940 |
141 |
| Rohm Co., Ltd. | 5843 |
110 |
| Changxin Memory Technologies, Inc. | 4732 |
95 |
| Infineon Technologies AG | 8189 |
94 |
| Tokyo Electron Limited | 11599 |
92 |
| Other owners | 4389 |